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 HAT2202C
Silicon N Channel MOS FET Power Switching
REJ03G1236-0600 Rev.6.00 Oct 01, 2009
Features
* Low on-resistance RDS(on) = 31 m typ. (at VGS = 4.5 V) * Low drive current. * High density mounting * 2.5 V gate drive devices.
Outline
RENESAS Package code: PWSF0006JA-A (Package name: CMFPAK-6) Indexband 6 5 4 6 G 2345 DD DD
1. Source 2. Drain 3. Drain 4. Drain 5. Drain 6. Gate
1
2
3
S 1
Absolute Maximum Ratings
(Ta = 25C)
Item Symbol Drain to source voltage VDSS Gate to source voltage VGSS Drain current ID Drain peak current ID (pulse)Note1 Body - Drain diode reverse drain current IDR Channel dissipation PchNote 2 Channel temperature Tch Storage temperature Tstg Notes: 1. PW 10 s, duty cycle 1% 2. When using the glass epoxy board. (FR4 40 x 40 x 1.6 mm) Ratings 20 12 3 12 3 900 150 -55 to +150 Unit V V A A A mW C C
REJ03G1236-0600 Rev.6.00 Oct 01, 2009 Page 1 of 6
HAT2202C
Electrical Characteristics
(Ta = 25C)
Item Drain to Source breakdown voltage Gate to Source breakdown voltage Gate to Source leakage current Drain to Source leakage current Gate to Source cutoff voltage Drain to Source on state resistance Forward transfer admittance Input capacitance Output capacitance Reverse transfer capacitance Total gate charge Gate to Source charge Gate to Drain charge Turn - on delay time Rise time Turn - off delay time Fall time Body - Drain diode forward voltage Notes: 3. Pulse test Symbol V(BR)DSS V(BR)GSS IGSS IDSS VGS(th) RDS(on) |yfs| Ciss Coss Crss Qg Qgs Qgd td(on) tr td(off) tf VDF Min 20 12 -- -- 0.4 -- -- 6.5 -- -- -- -- -- -- -- -- -- -- -- Typ -- -- -- -- -- 31 43 9.5 520 115 60 6 1 1.4 9 8 28 6 0.8 Max -- -- 10 1 1.4 40 55 -- -- -- -- -- -- -- -- -- -- -- 1.1 Unit V V A A V m m S pF pF pF nC nC nC ns ns ns ns V Test Conditions ID = 10 mA, VGS = 0 IG = 100 A, VDS = 0 VGS = 10V, VDS = 0 VDS = 20 V, VGS = 0 ID = 10 V, ID = 1 mA ID = 1.5 A, VGS =4.5 V Note3 ID = 1.5 A, VGS = 2.5 V Note3 ID = 1.5 A, VDS = 10 V Note3 VDS = 10 V, VGS = 0, f = 1 MHz VDD = 10 V, VGS = 4.5 V, ID = 3 A ID = 1.5 A, VGS = 10 V, VDD =10 V, RL= 6.7 , Rg = 4.7 IF = 3 A, VGS = 0 Note3
REJ03G1236-0600 Rev.6.00 Oct 01, 2009 Page 2 of 6
HAT2202C
Main Characteristics
Power vs. Temperature Derating
1.6
Maximum Safe Operation Area
100
Ta = 25C,1shot pulse When using the FR4 board. PW = 100 s
Pch (W)
Test Condition : When using the glass epoxy board (FR4 40 x 40 x 1.6 mm)
30 PW =10 s
1.2
Drain Current ID (A)
10
PW
PW
Channel Dissipation
3 1 0.3 0.1 0.03
D C O
= 1 m s
= 10
0.8
m s
0.4
Operation in this area is limited by RDS(on)
pe ra tio n
0
50
100
150
200
0.01
0.03 0.1 0.3
1
3
10
30 100
Ambient Temperature
Ta (C)
Drain to Source Voltage VDS (V)
Typical Output Characteristics
20 4.5 V 2.5 V 2.0 V 1.8 V 8 1.6 V 4 VGS = 1.2 V 2 4 6 8 1.4 V 0 Pulse Test 20
Typical Transfer Characteristics
VDS = 10 V Pulse Test
Drain Current ID (A)
12
Drain Current ID (A)
16
16
12
8
4 75C 25C Tc = -25C 2 3 4 5
0
10
1
Drain to Source Voltage VDS (V)
Gate to Source Voltage VGS (V)
Drain to Source Saturation Voltage vs. Gate to Source Voltage
Drain to Source Voltage VDS(on) (mV)
160 Pulse Test
Static Drain to Source on State Resistance vs. Drain Current
Drain to Source On State Resistance RDS(on) (m)
1000 Pulse Test
120
80
3A
100 2.5 V VGS = 4.5 V
40
1.5 A
ID = 1 A 0 2 4 6 8 10
10 0.1
1
10
100
Gate to Source Voltage VGS (V)
Drain Current ID (A)
REJ03G1236-0600 Rev.6.00 Oct 01, 2009 Page 3 of 6
HAT2202C
Static Drain to Source on State Resistance vs. Temperature
75
Static Drain to Source on State Resistance RDS(on) (m)
Forward Transfer Admittance vs. Drain Current
Forward Transfer Admittance |yfs| (S)
100 30 10 3 1 0.3 0.1 0.1 Tc = -25C 25C
60 VGS = 2.5 V 45
3A ID = 1, 1.5 A
75C
30 4.5 V 15 0 -25
1, 1.5 ,3 A
Pulse Test 0 25 50 75 100 125 150
VDS = 10 V Pulse Test 0.3 1 3 10
Case Temperature
Tc
(C)
Drain Current ID (A)
Dynamic Input Characteristics
Drain to Source Voltage VDS (V)
ID = 3 A VGS 30 VDD = 5 V 10 V 20 V VDD 6
Typical Capacitance vs. Drain to Source Voltage
Gate to Source Voltage VGS (V)
8 1000 Ciss
40
Capacitance C (pF)
300
20
4
100
Coss Crss
10
VDD = 20 V 10 V 5V 2 4 6 8
2
30 VGS = 0 f = 1 MHz 0 5 10 15 20 25
0
0 10
10
Gate Charge Qg (nc)
Drain to Source Voltage VDS (V)
Reverse Drain Current vs. Source to Drain Voltage
20 100
Switching Characteristics
tr
Reverse Drain Current IDR (A)
16 5V 12 VGS = 0 V
Switching Time t (ns)
td(off) td(on) tf
10
8
4 Pulse Test 0 0.4 0.8 1.2 1.6 2.0
1 0.1
VGS = 4.5 V, VDD = 10 V Rg = 4.7 , duty 1 % 0.3 1 3 10 30 100
Source to Drain Voltage VSD (V)
Drain Current ID (A)
REJ03G1236-0600 Rev.6.00 Oct 01, 2009 Page 4 of 6
HAT2202C
Switching Time Test Circuit Waveform
Vin Monitor D.U.T. RL 4.7 Vin 10 V
Vout Monitor Vin Vout VDD = 10 V 10% 10%
90%
10%
90% td(on) tr
90% td(off) tf
REJ03G1236-0600 Rev.6.00 Oct 01, 2009 Page 5 of 6
HAT2202C
Package Dimensions
Package Name CMFPAK-6 JEITA Package Code RENESAS Code PWSF0006JA-A Previous Code CMFPAK-6 / CMFPAK-6V MASS[Typ.] 0.0065g
D e A c LP
E
HE
A xM
A S A b
L
Reference Symbol
Dimension in Millimeters
e A2 A
yS
A1 S e1 b b1 l1 c1 b2 Pattern of terminal position areas
c
A-A Section
A A1 A2 b b1 c c1 D E e HE L LP x y b2 e1 l1
Min 0.6 0 0.7 0.15 0.1 1.9 1.6 2.05 0.1 0.15
Nom
0.22 0.2 0.13 0.11 2.0 1.7 0.65 2.1 0.2
Max 0.8 0.01 0.79 0.3 0.15 2.1 1.8 2.15 0.3 0.45 0.05 0.05 0.35 0.5
1.65
Ordering Information
Part No. HAT2202C-EL-E Quantity 3000 pcs Taping Shipping Container
REJ03G1236-0600 Rev.6.00 Oct 01, 2009 Page 6 of 6
Sales Strategic Planning Div.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Notes: 1. This document is provided for reference purposes only so that Renesas customers may select the appropriate Renesas products for their use. Renesas neither makes warranties or representations with respect to the accuracy or completeness of the information contained in this document nor grants any license to any intellectual property rights or any other rights of Renesas or any third party with respect to the information in this document. 2. Renesas shall have no liability for damages or infringement of any intellectual property or other rights arising out of the use of any information in this document, including, but not limited to, product data, diagrams, charts, programs, algorithms, and application circuit examples. 3. You should not use the products or the technology described in this document for the purpose of military applications such as the development of weapons of mass destruction or for the purpose of any other military use. When exporting the products or technology described herein, you should follow the applicable export control laws and regulations, and procedures required by such laws and regulations. 4. All information included in this document such as product data, diagrams, charts, programs, algorithms, and application circuit examples, is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas products listed in this document, please confirm the latest product information with a Renesas sales office. Also, please pay regular and careful attention to additional and different information to be disclosed by Renesas such as that disclosed through our website. (http://www.renesas.com ) 5. Renesas has used reasonable care in compiling the information included in this document, but Renesas assumes no liability whatsoever for any damages incurred as a result of errors or omissions in the information included in this document. 6. When using or otherwise relying on the information in this document, you should evaluate the information in light of the total system before deciding about the applicability of such information to the intended application. Renesas makes no representations, warranties or guaranties regarding the suitability of its products for any particular application and specifically disclaims any liability arising out of the application and use of the information in this document or Renesas products. 7. With the exception of products specified by Renesas as suitable for automobile applications, Renesas products are not designed, manufactured or tested for applications or otherwise in systems the failure or malfunction of which may cause a direct threat to human life or create a risk of human injury or which require especially high quality and reliability such as safety systems, or equipment or systems for transportation and traffic, healthcare, combustion control, aerospace and aeronautics, nuclear power, or undersea communication transmission. If you are considering the use of our products for such purposes, please contact a Renesas sales office beforehand. Renesas shall have no liability for damages arising out of the uses set forth above. 8. 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Renesas shall have no liability for malfunctions or damages arising out of the use of Renesas products beyond such specified ranges. 10. Although Renesas endeavors to improve the quality and reliability of its products, IC products have specific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Please be sure to implement safety measures to guard against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a Renesas product, such as safety design for hardware and software including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other applicable measures. Among others, since the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or system manufactured by you. 11. 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RENESAS SALES OFFICES
Refer to "http://www.renesas.com/en/network" for the latest and detailed information. Renesas Technology America, Inc. 450 Holger Way, San Jose, CA 95134-1368, U.S.A Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501 Renesas Technology Europe Limited Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K. Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900 Renesas Technology (Shanghai) Co., Ltd. Unit 204, 205, AZIACenter, No.1233 Lujiazui Ring Rd, Pudong District, Shanghai, China 200120 Tel: <86> (21) 5877-1818, Fax: <86> (21) 6887-7858/7898 Renesas Technology Hong Kong Ltd. 7th Floor, North Tower, World Finance Centre, Harbour City, Canton Road, Tsimshatsui, Kowloon, Hong Kong Tel: <852> 2265-6688, Fax: <852> 2377-3473 Renesas Technology Taiwan Co., Ltd. 10th Floor, No.99, Fushing North Road, Taipei, Taiwan Tel: <886> (2) 2715-2888, Fax: <886> (2) 3518-3399 Renesas Technology Singapore Pte. Ltd. 1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632 Tel: <65> 6213-0200, Fax: <65> 6278-8001 Renesas Technology Korea Co., Ltd. Kukje Center Bldg. 18th Fl., 191, 2-ka, Hangang-ro, Yongsan-ku, Seoul 140-702, Korea Tel: <82> (2) 796-3115, Fax: <82> (2) 796-2145
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(c) 2009. Renesas Technology Corp., All rights reserved. Printed in Japan.
Colophon .7.2


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